Issued Patents 2020
Showing 26–50 of 164 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10867941 | Semiconductor device and method | Ming-Che Ho, Hung-Jui Kuo, Yi-Wen Wu, Tzung-Hui Lee | 2020-12-15 |
| 10866373 | Optical transceiver and manufacturing method thereof | Hsing-Kuo Hsia, Sung-Hui Huang, Kuan-Yu Huang, Kuo-Chiang Ting, Shang-Yun Hou +1 more | 2020-12-15 |
| 10867936 | Semiconductor device with shield for electromagnetic interference | Chuei-Tang Wang, Wei-Ting Chen, Chieh-Yen Chen | 2020-12-15 |
| 10867965 | Package structures and methods of forming the same | Ying-Ching Shih, Chi-Hsi Wu, Chih-Wei Wu, Jing-Cheng Lin, Pu Wang +1 more | 2020-12-15 |
| 10867878 | Dam for three-dimensional integrated circuit | Tsung-Ding Wang, An-Jhih Su, Chien Ling Hwang, Jung Wei Cheng, Hsin-Yu Pan | 2020-12-15 |
| 10867947 | Semiconductor packages and methods of manufacturing the same | Jiun Yi Wu, Yu-Min Liang | 2020-12-15 |
| 10867832 | Apparatus for holding semiconductor wafers | Chien Ling Hwang | 2020-12-15 |
| 10861773 | Semiconductor package and manufacturing method thereof | Chun-Hui Yu, Kuo-Chung Yee | 2020-12-08 |
| 10859922 | Lithography system and method | Ming-Tan Lee, Hung-Jui Kuo | 2020-12-08 |
| 10861809 | Semiconductor structure and method of forming | Yu-Hsiang Hu, Hung-Jui Kuo | 2020-12-08 |
| 10861814 | Integrated fan-out packages and methods of forming the same | Tzung-Hui Lee, Chi-Ming Tsai, Hung-Jui Kuo, Ming-Che Ho | 2020-12-08 |
| 10861835 | Solution for reducing poor contact in InFO package | Jing-Cheng Lin, Szu-Wei Lu, Shih-Ting Lin, Shin-Puu Jeng | 2020-12-08 |
| 10854568 | Packages with Si-substrate-free interposer and method forming same | Ming-Fa Chen | 2020-12-01 |
| 10854552 | Semiconductor device and method of manufacture | Jiun Yi Wu, Chung-Shi Liu, Chien-Hsun Lee | 2020-12-01 |
| 10854580 | Semiconductor structure along with multiple chips bonded through microbump and manufacturing method thereof | Wei-Heng Lin, Tung-Liang Shao, Chih-Hang Tung | 2020-12-01 |
| 10854577 | 3D die stacking structure with fine pitches | Chen-Shien Chen, Shou-Cheng Hu | 2020-12-01 |
| 10853616 | Fingerprint sensor device and method | Yu-Feng Chen, Chih-Hua Chen, Hao-Yi Tsai, Chung-Shi Liu | 2020-12-01 |
| 10847505 | Multi-chip semiconductor package | Yu-Chia Lai, Kuo Lung Pan, Hung-Yi Kuo, Tin-Hao Kuo, Hao-Yi Tsai +1 more | 2020-11-24 |
| 10847414 | Embedded 3D interposer structure | Ying-Ching Shih, Jing-Cheng Lin, Wen-Chih Chiou, Shin-Puu Jeng | 2020-11-24 |
| 10847459 | Semiconductor die contact structure and method | Chung-Shi Liu | 2020-11-24 |
| 10847493 | Bump-on-trace interconnect | Chen-Shien Chen | 2020-11-24 |
| 10847304 | InFO coil on metal plate with slot | Chuei-Tang Wang, Wei-Ting Chen, Chieh-Yen Chen, Hao-Yi Tsai, Ming Hung Tseng +1 more | 2020-11-24 |
| 10840218 | Semiconductor device and method of manufacture | Jing-Cheng Lin, Po-Hao Tsai | 2020-11-17 |
| 10840227 | Under-bump-metallization structure and redistribution layer design for integrated fan-out package with integrated passive device | Yu-Chih Huang, Chi-Hui Lai, Ban-Li Wu, Ying-Cheng Tseng, Ting-Ting Kuo +5 more | 2020-11-17 |
| 10840217 | Stacked chip package and methods of manufacture thereof | Ming-Fa Chen, Sung-Feng Yeh | 2020-11-17 |