Issued Patents 2020
Showing 76–100 of 164 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10784207 | Multi-stacked package-on-package structures | An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Ming-Shih Yeh, Wei-Cheng Wu | 2020-09-22 |
| 10777518 | Package structure and method of manufacturing the same | Chuei-Tang Wang, Tzu-Chun Tang, Chieh-Yen Chen, Che-Wei Hsu | 2020-09-15 |
| 10777430 | Photonic integrated package and method forming same | An-Jhih Su, Wei-Yu Chen | 2020-09-15 |
| 10777502 | Semiconductor chip, package structure, and pacakge-on-package structure | Chuei-Tang Wang, Chung-Hao Tsai, Wei-Ting Chen | 2020-09-15 |
| 10770655 | CHIP package | Kuo-Chung Yee | 2020-09-08 |
| 10770365 | Package structures and methods of forming the same | Hsien-Pin Hu, Jing-Cheng Lin, Szu-Wei Lu, Shang-Yun Hou, Wen-Hsin Wei +2 more | 2020-09-08 |
| 10770428 | Semiconductor device and method | Chun-Hui Yu, Kuo-Chung Yee | 2020-09-08 |
| 10770795 | Antenna device and method for manufacturing antenna device | Chuei-Tang Wang, Chung-Hao Tsai, Jeng-Shien Hsieh, Wei-Heng Lin, Kuo-Chung Yee | 2020-09-08 |
| 10772205 | Circuit board, semiconductor device including the same, and manufacturing method thereof | Jiun Yi Wu, Chien-Hsun Lee, Chung-Shi Liu | 2020-09-08 |
| 10763229 | Semiconductor structure | Vincent Chen, Hung-Yi Kuo, Chuei-Tang Wang, Hao-Yi Tsai, Wei-Ting Chen +2 more | 2020-09-01 |
| 10763164 | Package structure with inductor and method of forming thereof | Chih-Lin Chen, Chung-Hao Tsai, Jeng-Shien Hsieh, Chuei-Tang Wang, Chih-Yuan Chang | 2020-09-01 |
| 10756010 | Semiconductor device packaging structure having through interposer vias and through substrate vias | Sung-Feng Yeh, Ming-Fa Chen, Hsien-Wei Chen, Tzuan-Horng Liu | 2020-08-25 |
| 10746923 | Photonic semiconductor device and method | Hsing-Kuo Hsia, Kuo-Chiang Ting, Pin-Tso Lin, Sung-Hui Huang, Shang-Yun Hou +1 more | 2020-08-18 |
| 10748870 | Tri-layer COWOS structure | Shang-Yun Hou, Yun-Han Lee | 2020-08-18 |
| 10748841 | Packages with Si-substrate-free interposer and method forming same | Ming-Fa Chen | 2020-08-18 |
| 10734295 | Interposer test structures and methods | Tzuan-Horng Liu, Hsien-Pin Hu, Tzu-Yu Wang, Wei-Cheng Wu, Shang-Yun Hou +1 more | 2020-08-04 |
| 10734348 | Bonded semiconductor devices and methods of forming the same | Tung-Liang Shao, Chih-Hang Tung | 2020-08-04 |
| 10734345 | Packaging through pre-formed metal pins | Chien Ling Hwang, Yeong-Jyh Lin | 2020-08-04 |
| 10734323 | Package structures | Chun-Wen Lin, Chung-Hao Tsai, Chuei-Tang Wang, Che-Wei Hsu | 2020-08-04 |
| 10734279 | Semiconductor package device with integrated antenna and manufacturing method thereof | Wen-Shiang Liao, Feng-Wei Kuo, Chih-Hang Tung | 2020-08-04 |
| 10727217 | Method of manufacturing semiconductor device that uses bonding layer to join semiconductor substrates together | Ming-Fa Chen | 2020-07-28 |
| 10727201 | Packages formed using RDL-last process | Ming-Fa Chen | 2020-07-28 |
| 10720409 | Semiconductor packages with thermal-electrical-mechanical chips and methods of forming the same | Der-Chyang Yeh, Hsien-Wei Chen, Li-Hsien Huang, Yueh-Ting Lin, Wei-Yu Chen +1 more | 2020-07-21 |
| 10720788 | Wireless charging devices having wireless charging coils and methods of manufacture thereof | Chita Chuang, Chen-Shien Chen, Ming Hung Tseng, Sen-Kuei Hsu, Yu-Feng Chen +1 more | 2020-07-21 |
| 10720388 | Wireless charging package with chip integrated in coil center | Chiang-Jui Chu, Chung-Shi Liu, Hao-Yi Tsai, Ming Hung Tseng, Hung-Yi Kuo | 2020-07-21 |