Issued Patents 2020
Showing 101–125 of 164 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10714414 | Planarizing RDLS in RDL—First Processes Through CMP Process | Po-Han Wang, Yu-Hsiang Hu, Hung-Jui Kuo | 2020-07-14 |
| 10714457 | Semiconductor packages and methods of forming same | Chih-Hang Tung, Kuo-Chung Yee | 2020-07-14 |
| 10714426 | Semiconductor package and method of forming the same | Cheng-Hsien Hsieh, Li-Han Hsu, Wei-Cheng Wu, Hsien-Wei Chen, Der-Chyang Yeh +2 more | 2020-07-14 |
| 10714359 | Substrate design for semiconductor packages and method of forming same | Jung Wei Cheng, Tsung-Ding Wang, Mirng-Ji Lii, Chien-Hsun Lee | 2020-07-14 |
| 10707173 | Package structure and manufacturing method thereof | Kai-Chiang Wu, Kuo-Chung Yee | 2020-07-07 |
| 10707094 | Semiconductor package and manufacturing process thereof | Yu-Feng Chen, Chih-Hua Chen, Chung-Shi Liu, Hung-Jui Kuo, Hui-Jung Tsai +1 more | 2020-07-07 |
| 10698994 | Fingerprint sensor pixel array and methods of forming same | Yu-Chih Huang, Chih-Hsuan Tai, Yu-Jen Cheng, Chih-Hua Chen, Yu-Feng Chen +2 more | 2020-06-30 |
| 10700045 | Surface mount device/integrated passive device on package or device structure and methods of forming | Cheng-Hsien Hsieh, Hsien-Wei Chen, Chi-Hsi Wu, Der-Chyang Yeh, Wei-Cheng Wu | 2020-06-30 |
| 10700025 | Fan-out interconnect structure and method for forming same | Yen-Chang Hu, Ching-Wen Hsiao, Mirng-Ji Lii, Chung-Shi Liu, Chien Ling Hwang +2 more | 2020-06-30 |
| 10692817 | Semiconductor device with shielding structure for cross-talk reduction | Shih-Ya Huang, Chung-Hao Tsai, Chuei-Tang Wang, Chih-Yuan Chang | 2020-06-23 |
| 10685911 | Semiconductor package and manufacturing method of the same | Ming-Fa Chen, Sung-Feng Yeh | 2020-06-16 |
| 10685937 | Integrated circuit package having dummy structures and method of forming same | Ming-Fa Chen, Hsien-Wei Chen | 2020-06-16 |
| 10685910 | Packages with Si-substrate-free interposer and method forming same | Sung-Feng Yeh, Ming-Fa Chen, Hsien-Wei Chen | 2020-06-16 |
| 10679951 | Chip-on-substrate packaging on carrier | Tzu-Shiun Sheu, Shin-Puu Jeng, Shih-Peng Tai, An-Jhih Su, Chi-Hsi Wu | 2020-06-09 |
| 10679968 | Package with thinned substrate | Chung-Hao Tsai, Chuei-Tang Wang | 2020-06-09 |
| 10679947 | Chip package and manufacturing method thereof | Chuei-Tang Wang | 2020-06-09 |
| 10672674 | Method of forming semiconductor device package having testing pads on a topmost die | Sung-Feng Yeh, Ming-Fa Chen, Hsien-Wei Chen, Hui Liu, Ching-Pin Yuan | 2020-06-02 |
| 10672741 | Semiconductor packages with thermal-electrical-mechanical chips and methods of forming the same | Der-Chyang Yeh, Hsien-Wei Chen, Li-Hsien Huang, Yueh-Ting Lin, Wei-Yu Chen +1 more | 2020-06-02 |
| 10672738 | Package structures and methods of forming | Der-Chyang Yeh, Hsien-Wei Chen | 2020-06-02 |
| 10672647 | Wafer level chip scale packaging intermediate structure apparatus and method | Der-Chyang Yeh | 2020-06-02 |
| 10665468 | Multi-chip structure and method of forming same | Der-Chyang Yeh | 2020-05-26 |
| 10665582 | Method of manufacturing semiconductor package structure | Yi-Hsiu Chen, Ming-Fa Chen, Wen-Chih Chiou | 2020-05-26 |
| 10665560 | Optical semiconductor package and method for manufacturing the same | Chuei-Tang Wang, Chih-Chieh Chang, Yu-Kuang Liao, Hsing-Kuo Hsia, Chih-Yuan Chang +1 more | 2020-05-26 |
| 10665540 | Redistribution layer structures for integrated circuit package | Jie Chen, Ying-Ju Chen, Hsien-Wei Chen, Der-Chyang Yeh | 2020-05-26 |
| 10663512 | Testing of semiconductor chips with microbumps | Wei-Cheng Wu, Hsien-Pin Hu, Shang-Yun Hou, Shin-Puu Jeng, Chao-Hsiang Yang | 2020-05-26 |