Issued Patents 2020
Showing 126–150 of 164 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10658337 | Packages and packaging methods for semiconductor devices, and packaged semiconductor devices | Shin-Puu Jeng, Hsien-Wei Chen, Der-Chyang Yeh, An-Jhih Su | 2020-05-19 |
| 10658348 | Semiconductor devices having a plurality of first and second conductive strips | Chih-Hsuan Tai, Chi-Hui Lai, Ying-Cheng Tseng, Ban-Li Wu, Ting-Ting Kuo +4 more | 2020-05-19 |
| 10658347 | Semiconductor packages and methods of forming the same | Jing-Cheng Lin, Po-Hao Tsai | 2020-05-19 |
| 10658199 | Semiconductor device and method | Sih-Hao Liao, Yu-Hsiang Hu, Hung-Jui Kuo | 2020-05-19 |
| 10651149 | Packages formed using RDL—last process | Ming-Fa Chen | 2020-05-12 |
| 10651675 | Packaged semiconductor devices with wireless charging means | Hao-Yi Tsai, Tzu-Sung Huang, Ming Hung Tseng, Hung-Yi Kuo | 2020-05-12 |
| 10651137 | Manufacturing method of a package structure | Kuo-Chung Yee | 2020-05-12 |
| 10643965 | Structure and method of forming a joint assembly | Ying-Ju Chen, An-Jhih Su, Hsien-Wei Chen, Der-Chyang Yeh, Chi-Hsi Wu | 2020-05-05 |
| 10643864 | Fan-out structure and method of fabricating the same | An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Hsien-Wei Chen, Wei-Yu Chen | 2020-05-05 |
| 10636748 | Package structure | Jing-Cheng Lin, Tsei-Chung Fu | 2020-04-28 |
| 10638616 | Circuit carrier and manifacturing method thereof | Jiun Yi Wu, Chien-Hsun Lee, Chung-Shi Liu | 2020-04-28 |
| 10636715 | Semiconductor package and method of fabricating the same | Chun-Cheng Lin, Ching-Hua Hsieh, Chung-Shi Liu, Chih-Wei Lin | 2020-04-28 |
| 10629508 | Packaged semiconductor devices and methods of packaging semiconductor devices | Chung-Shi Liu, Chih-Fan Huang, Chih-Wei Lin, Wei-Hung Lin, Ming-Da Cheng | 2020-04-21 |
| 10629541 | Semiconductor structure and manufacturing method thereof | Kuo-Chung Yee, Jui-Pin Hung | 2020-04-21 |
| 10629540 | Semiconductor device and method | Hui-Jung Tsai, Hung-Jui Kuo, Chung-Shi Liu, Han-Ping Pu, Ting-Chu Ko | 2020-04-21 |
| 10629537 | Conductive vias in semiconductor packages and methods of forming same | Cheng-Hsien Hsieh, Li-Han Hsu, Wei-Cheng Wu, Hsien-Wei Chen, Der-Chyang Yeh +1 more | 2020-04-21 |
| 10629477 | Raised via for terminal connections on different planes | An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Ming-Shih Yeh, Jing-Cheng Lin +1 more | 2020-04-21 |
| 10622302 | Via for semiconductor device connection and methods of forming the same | An-Jhih Su, Chi-Hsi Wu, Wen-Chih Chiou, Tsang-Jiuh Wu, Der-Chyang Yeh +1 more | 2020-04-14 |
| 10622701 | Antenna apparatus and method | Lai Wei Chih, Monsen Liu, En-Hsiang Yeh, Chuei-Tang Wang | 2020-04-14 |
| 10622327 | Method for manufacturing semiconductor structure | Ming-Fa Chen, Sung-Feng Yeh | 2020-04-14 |
| 10622321 | Semiconductor structures and methods of forming the same | Hung-Jui Kuo, Hui-Jung Tsai, Tsao-Lun Chang | 2020-04-14 |
| 10622297 | Semiconductor device and method | Jing-Cheng Lin, Chi-Hsi Wu, Po-Hao Tsai | 2020-04-14 |
| 10566237 | Profile of through via protrusion in 3DIC interconnect | Jiung Wu, Kuan-Liang Lai, Ming-Tsu Chung, Hong-Ye Shih, Ku-Feng Yang +3 more | 2020-02-18 |
| 10559546 | Package on package structure and method for forming the same | Chung-Shi Liu, Ming-Da Cheng, Mirng-Ji Lii, Meng-Tse Chen, Wei-Hung Lin | 2020-02-11 |
| 10555424 | Circuit board, semiconductor device including the same, and manufacturing method thereof | Jiun Yi Wu, Chien-Hsun Lee, Chung-Shi Liu | 2020-02-04 |