Issued Patents 2020
Showing 151–164 of 164 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10553569 | Multi-die structure and method for forming same | Po-Hao Tsai, Jing-Cheng Lin, Li-Hui Cheng | 2020-02-04 |
| 10541227 | System on integrated chips and methods of forming same | Sung-Feng Yeh, Ming-Fa Chen | 2020-01-21 |
| 10541228 | Packages formed using RDL-last process | Ming-Fa Chen | 2020-01-21 |
| 10541226 | Package structure and method of forming the same | Li-Hsien Huang, Chi-Hsi Wu, Der-Chyang Yeh, Hsien-Wei Chen, An-Jhih Su +1 more | 2020-01-21 |
| 10535631 | 3D Chip-on-wager-on-substrate structure with via last process | Ming-Fa Chen, Wen-Ching Tsai, Sung-Feng Yeh | 2020-01-14 |
| 10535913 | Package structure, electronic device and method of fabricating package structure | Min-Chien Hsiao, Chung-Shi Liu, Chao-Wen Shih, Shou-Zen Chang | 2020-01-14 |
| 10535639 | Semiconductor device and manufacturing method of the same | Jing-Cheng Lin, Ying-Ching Shih, Pu Wang | 2020-01-14 |
| 10535629 | Method of manufacturing semiconductor structure | Alexander Kalnitsky, Yi-Yang Lei, Hsi-Ching Wang, Cheng-Yu Kuo, Tsung Lung Huang +9 more | 2020-01-14 |
| 10529666 | Semiconductor structure and manufacturing method thereof | Kai-Chiang Wu, Chun-Lin Lu | 2020-01-07 |
| 10530175 | Hexagonal semiconductor package structure | Tzu-Sung Huang, Hao-Yi Tsai, Hung-Yi Kuo, Ming Hung Tseng | 2020-01-07 |
| 10529698 | Semiconductor packages and methods of forming same | Der-Chyang Yeh, Han-Ping Pu | 2020-01-07 |
| 10529690 | Package structures and methods of forming the same | Ying-Ching Shih, Chi-Hsi Wu, Chih-Wei Wu, Jing-Cheng Lin, Pu Wang +1 more | 2020-01-07 |
| 10529637 | Integrated circuit package and method of forming same | Chih-Wei Wu, Ying-Ching Shih, Szu-Wei Lu | 2020-01-07 |
| 10529675 | Info structure and method forming same | Po-Han Wang, Yu-Hsiang Hu, Hung-Jui Kuo | 2020-01-07 |