Issued Patents 2020
Showing 51–75 of 164 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10833030 | Semiconductor device and method of manufacture | Cheng-Hsien Hsieh, Hsien-Wei Chen, Tsung-Shu Lin, Wei-Cheng Wu | 2020-11-10 |
| 10833039 | Multi-chip fan out package and methods of forming the same | Jing-Cheng Lin, Jui-Pin Hung | 2020-11-10 |
| 10832985 | Sensor package and method | Tsung-Hsien Chiang, Yu-Chih Huang, Ting-Ting Kuo, Chih-Hsuan Tai, Ban-Li Wu +5 more | 2020-11-10 |
| 10825696 | Cross-wafer RDLs in constructed wafers | Tin-Hao Kuo | 2020-11-03 |
| 10825773 | Package structure with reinforcement structures in a redistribution circuit structure and method of manufacturing the same | Chun-Lin Lu, Han-Ping Pu, Kai-Chiang Wu | 2020-11-03 |
| 10825693 | Carrier warpage control for three dimensional integrated circuit (3DIC) stacking | Jing-Cheng Lin, Shih-Ting Lin | 2020-11-03 |
| 10825798 | Packages with stacked dies and methods of forming the same | Chien-Hsun Lee, Tsung-Ding Wang, Mirng-Ji Lii | 2020-11-03 |
| 10825602 | Stacked coil for wireless charging structure on InFO package | Tzu-Chun Tang, Chuei-Tang Wang, Hao-Yi Tsai, Ming Hung Tseng, Chieh-Yen Chen +1 more | 2020-11-03 |
| 10818640 | Die stacks and methods forming same | Chung-Hao Tsai, Chuei-Tang Wang | 2020-10-27 |
| 10818607 | Semiconductor device and method of manufacture | Jing-Cheng Lin, Po-Hao Tsai | 2020-10-27 |
| 10811389 | Semiconductor package for thermal dissipation | Shin-Puu Jeng, Der-Chyang Yeh, Hsien-Wei Chen, Cheng-Chieh Hsieh, Ming-Yen Chiu | 2020-10-20 |
| 10811394 | Devices employing thermal and mechanical enhanced layers and methods of forming same | An-Jhih Su, Wei-Yu Chen, Ying-Ju Chen, Tsung-Shu Lin, Chin-Chuan Chang +5 more | 2020-10-20 |
| 10811404 | Package structure and method of manufacturing the same | Shih-Ya Huang, Chung-Hao Tsai, Chuei-Tang Wang | 2020-10-20 |
| 10804247 | Chip package structure with conductive shielding film | An-Jhih Su, Jing-Cheng Lin, Po-Hao Tsai | 2020-10-13 |
| 10804178 | Integrated circuit package and method of forming same | Chih-Wei Wu, Ying-Ching Shih, Szu-Wei Lu | 2020-10-13 |
| 10804242 | Methods of forming multi-die package structures including redistribution layers | Kuo-Chung Yee, Tsung-Ding Wang, Chien-Hsun Lee | 2020-10-13 |
| 10797038 | Semiconductor package and rework process for the same | An-Jhih Su, Shing-Chao Chen, Ching-Hua Hsieh, Chung-Shi Liu, Der-Chyang Yeh +1 more | 2020-10-06 |
| 10796927 | Integrated circuit package pad and methods of forming | Hsien-Wei Chen, Chi-Hsi Wu, Der-Chyang Yeh, An-Jhih Su, Wei-Yu Chen | 2020-10-06 |
| 10796990 | Semiconductor structure, package structure, and manufacturing method thereof | Wei-Ting Chen, Chung-Hao Tsai, Chuei-Tang Wang | 2020-10-06 |
| 10797031 | Semiconductor package | Yu-Kuang Liao, Cheng-Chun Tsai, Fang Chen, Wen-Chih Chiou, Ping-Jung Wu | 2020-10-06 |
| 10790269 | Semiconductor devices and semiconductor structures | Chi-Hui Lai, Chung-Shi Liu, Hao-Yi Tsai, Tin-Hao Kuo | 2020-09-29 |
| 10790261 | Bonding through multi-shot laser reflow | Wei-Yu Chen, Chia-Shen Cheng, Hao-Jan Pei, Philip Yu-Shuan Chung, Kuei-Wei Huang +4 more | 2020-09-29 |
| 10790244 | Semiconductor device and method | Tzu-Sung Huang, Hung-Yi Kuo, Hao-Yi Tsai, Ming Hung Tseng | 2020-09-29 |
| 10784162 | Method of making a semiconductor component having through-silicon vias | Cheng-Hung Chang, Ebin Liao, Chia-Lin Yu, Hsiang-Yi Wang, Chun Hua Chang +4 more | 2020-09-22 |
| 10784207 | Multi-stacked package-on-package structures | An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Ming-Shih Yeh, Wei-Cheng Wu | 2020-09-22 |