Issued Patents 2020
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879153 | Chip package structure | Chen-Hua Yu, Kuo-Chung Yee | 2020-12-29 |
| 10879220 | Package-on-package structure and manufacturing method thereof | Chen-Hua Yu, Kuo-Chung Yee | 2020-12-29 |
| 10861773 | Semiconductor package and manufacturing method thereof | Chen-Hua Yu, Kuo-Chung Yee | 2020-12-08 |
| 10770428 | Semiconductor device and method | Chen-Hua Yu, Kuo-Chung Yee | 2020-09-08 |
| 10714525 | Methods and apparatus for sensor module | Kuo-Chung Yee | 2020-07-14 |