Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10867884 | Heat spreading device and method | Chen-Hua Yu, Wensen Hung, Ming-Fa Chen | 2020-12-15 |
| 10867885 | Heat spreading device and method | Chen-Hua Yu, Wensen Hung, Ming-Fa Chen | 2020-12-15 |
| 10790254 | Chip package structure | Kuan-Yu Huang, Sung-Hui Huang, Shu-Chia Hsu, Leu-Jen Chen, Yi-Wei Liu +4 more | 2020-09-29 |