Issued Patents 2019
Showing 101–125 of 154 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10304801 | Redistribution layers in semiconductor packages and methods of forming same | Li-Hsien Huang, An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh | 2019-05-28 |
| 10304614 | Stacked coil for wireless charging structure on InFO package | Tzu-Chun Tang, Chuei-Tang Wang, Hao-Yi Tsai, Ming Hung Tseng, Chieh-Yen Chen +1 more | 2019-05-28 |
| 10297494 | Raised via for terminal connections on different planes | An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Ming-Shih Yeh, Jing-Cheng Lin +1 more | 2019-05-21 |
| 10297925 | Semiconductor device including integrated fan out antenna and method of forming the same | Chuei-Tang Wang, Jeng-Shieh Hsieh, Chung-Hao Tsai, Monsen Liu | 2019-05-21 |
| 10297579 | Package on-package structure with epoxy flux residue | Wei-Yu Chen, Kuei-Wei Huang, Hsiu-Jen Lin, Ming-Da Cheng, Ching-Hua Hsieh +2 more | 2019-05-21 |
| 10297560 | Semiconductor device and method | Ming-Che Ho, Hung-Jui Kuo, Yi-Wen Wu, Tzung-Hui Lee | 2019-05-21 |
| 10297550 | 3D IC architecture with interposer and interconnect structure for bonding dies | Hsien-Pin Hu, Ming-Fa Chen, Jing-Cheng Lin, Jiun-Ren Lai, Yung-Chi Lin | 2019-05-21 |
| 10297471 | Fan-out structure and method of fabricating the same | An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Hsien-Wei Chen, Wei-Yu Chen | 2019-05-21 |
| 10290571 | Packages with si-substrate-free interposer and method forming same | Sung-Feng Yeh, Ming-Fa Chen, Hsien-Wei Chen | 2019-05-14 |
| 10290611 | Semiconductor packages and methods of forming same | Chih-Hang Tung, Kuo-Chung Yee | 2019-05-14 |
| 10290609 | Semiconductor device and manufacturing method of the same | Jing-Cheng Lin, Ying-Ching Shih, Pu Wang | 2019-05-14 |
| 10290584 | Conductive vias in semiconductor packages and methods of forming same | Cheng-Hsien Hsieh, Li-Han Hsu, Wei-Cheng Wu, Hsien-Wei Chen, Der-Chyang Yeh +1 more | 2019-05-14 |
| 10290513 | Carrier warpage control for three dimensional integrated circuit (3DIC) stacking | Jing-Cheng Lin, Shih-Ting Lin | 2019-05-14 |
| 10283461 | Info structure and method forming same | Po-Han Wang, Yu-Hsiang Hu, Hung-Jui Kuo | 2019-05-07 |
| 10283473 | Package structure and manufacturing method thereof | Kuo-Chung Yee, Chun-Hui Yu | 2019-05-07 |
| 10283470 | Semiconductor package and manufacturing method thereof | Chih-Wei Lin, Shing-Chao Chen, Ching-Hua Hsieh, Chung-Shi Liu, Meng-Tse Chen +2 more | 2019-05-07 |
| 10283427 | Molding structure for wafer level package | Chung-Shi Liu, Chih-Fan Huang, Chih-Wei Lin, Wei-Hung Lin, Ming-Da Cheng | 2019-05-07 |
| 10283375 | Integrated circuit package pad and methods of forming | Hsien-Wei Chen, Chi-Hsi Wu, Der-Chyang Yeh, An-Jhih Su, Wei-Yu Chen | 2019-05-07 |
| 10276920 | Package structure, electronic device and method of fabricating package structure | Min-Chien Hsiao, Chung-Shi Liu, Chao-Wen Shih, Shou-Zen Chang | 2019-04-30 |
| 10276402 | Semiconductor package and manufacturing process thereof | Yu-Feng Chen, Chih-Hua Chen, Chung-Shi Liu, Hung-Jui Kuo, Hui-Jung Tsai +1 more | 2019-04-30 |
| 10276401 | 3D shielding case and methods for forming the same | Monsen Liu, Chuei-Tang Wang, Lai Wei Chih | 2019-04-30 |
| 10269762 | Rework process and tool design for semiconductor package | Shih-Ting Lin, Justin Huang, Tsung-Fu Tsai, Jing-Cheng Lin | 2019-04-23 |
| 10269757 | Integrated circuit with a thermally conductive underfill and methods of forming same | Tien-I Bao | 2019-04-23 |
| 10269752 | Package with UBM and methods of forming | Chien-Yu Li, Hung-Jui Kuo, Li-Hsien Huang, Hsien-Wei Chen, Der-Chyang Yeh +2 more | 2019-04-23 |
| 10269741 | Bond structures and the methods of forming the same | Wen-Chih Chiou, Ming-Fa Chen, Yi-Hsiu Chen | 2019-04-23 |