Issued Patents 2019
Showing 1–25 of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522490 | Semiconductor package and method of forming the same | Chi-Hsi Wu, Hsien-Wei Chen, Jie Chen | 2019-12-31 |
| 10522473 | Alignment mark design for packages | Li-Hsien Huang, Hsien-Wei Chen, Ching-Wen Hsiao, Shin-Puu Jeng, Chen-Hua Yu | 2019-12-31 |
| 10515875 | Interconnect structure for package-on-package devices | Jui-Pin Hung, Jing-Cheng Lin, Po-Hao Tsai, Yi-Jou Lin, Shuo-Mao Chen +1 more | 2019-12-24 |
| 10515865 | Underfill control structures and method | Ying-Ju Chen, An-Jhih Su, Hsien-Wei Chen, Chi-Hsi Wu, Chen-Hua Yu | 2019-12-24 |
| 10510670 | Pad structure design in fan-out package | Chen-Hua Yu, Shin-Puu Jeng, Hsien-Wei Chen | 2019-12-17 |
| 10510654 | Dummy metal with zigzagged edges | Cheng-Hsien Hsieh, Hsien-Wei Chen, Chi-Hsi Wu, Chen-Hua Yu, Li-Han Hsu +1 more | 2019-12-17 |
| 10510562 | Stacked semiconductor devices and methods of forming same | Hsien-Wei Chen, Li-Hsien Huang | 2019-12-17 |
| 10510556 | Integrated circuit package pad and methods of forming | Hsien-Wei Chen, Chen-Hua Yu, Chi-Hsi Wu, An-Jhih Su, Wei-Yu Chen | 2019-12-17 |
| 10510735 | Packages and methods of forming packages | Chen-Hua Yu, An-Jhih Su | 2019-12-17 |
| 10510717 | Chip on package structure and method | Chen-Hua Yu, Kuo-Chung Yee, Jui-Pin Hung | 2019-12-17 |
| 10510715 | Semiconductor structure and manufacturing method thereof | Chen-Hua Yu, Chi-Hsi Wu, Hsien-Wei Chen, An-Jhih Su, Tien-Chung Yang | 2019-12-17 |
| 10504877 | Surface mount device/integrated passive device on package or device structure and methods of forming | Cheng-Hsien Hsieh, Hsien-Wei Chen, Chi-Hsi Wu, Chen-Hua Yu, Wei-Cheng Wu | 2019-12-10 |
| 10475731 | Package with metal-insulator-metal capacitor and method of manufacturing the same | Shuo-Mao Chen, Chiung-Han Yeh | 2019-11-12 |
| 10475768 | Redistribution layers in semiconductor packages and methods of forming same | Cheng-Hsien Hsieh, Li-Han Hsu, Wei-Cheng Wu, Hsien-Wei Chen, Chi-Hsi Wu +1 more | 2019-11-12 |
| 10461036 | Multi-stacked package-on-package structures | Chen-Hua Yu, An-Jhih Su, Chi-Hsi Wu, Ming-Shih Yeh, Wei-Cheng Wu | 2019-10-29 |
| 10373923 | Package with passive devices and method of forming the same | Shuo-Mao Chen, Li-Hsien Huang | 2019-08-06 |
| 10366953 | Redistribution layer structures for integrated circuit package | Jie Chen, Chen-Hua Yu, Hsien-Wei Chen, Ying-Ju Chen | 2019-07-30 |
| 10347606 | Devices employing thermal and mechanical enhanced layers and methods of forming same | Chen-Hua Yu, An-Jhih Su, Wei-Yu Chen, Ying-Ju Chen, Tsung-Shu Lin +5 more | 2019-07-09 |
| 10319683 | Multi-stacked package-on-package structures | Chen-Hua Yu, An-Jhih Su, Chi-Hsi Wu, Ming-Shih Yeh, Wei-Cheng Wu | 2019-06-11 |
| 10319681 | Dummy features in redistribution layers (RDLS) and methods of forming same | Cheng-Hsien Hsieh, Li-Han Hsu, Wei-Cheng Wu, Hsien-Wei Chen, Chi-Hsi Wu +1 more | 2019-06-11 |
| 10304801 | Redistribution layers in semiconductor packages and methods of forming same | Li-Hsien Huang, An-Jhih Su, Chi-Hsi Wu, Chen-Hua Yu | 2019-05-28 |
| 10297494 | Raised via for terminal connections on different planes | Chen-Hua Yu, An-Jhih Su, Chi-Hsi Wu, Ming-Shih Yeh, Jing-Cheng Lin +1 more | 2019-05-21 |
| 10297471 | Fan-out structure and method of fabricating the same | Chen-Hua Yu, An-Jhih Su, Chi-Hsi Wu, Hsien-Wei Chen, Wei-Yu Chen | 2019-05-21 |
| 10290610 | PoP device and method of forming the same | Li-Hsien Huang, An-Jhih Su, Hua-Wei Tseng, Li-Hui Cheng, Po-Hao Tsai +2 more | 2019-05-14 |
| 10290584 | Conductive vias in semiconductor packages and methods of forming same | Cheng-Hsien Hsieh, Li-Han Hsu, Wei-Cheng Wu, Hsien-Wei Chen, Chi-Hsi Wu +1 more | 2019-05-14 |