Issued Patents 2019
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522496 | Method for a stacked and bonded semiconductor device | Po-Hao Tsai, Jing-Cheng Lin | 2019-12-31 |
| 10522476 | Package structure, integrated fan-out package and method of fabricating the same | Jing-Cheng Lin, Po-Hao Tsai | 2019-12-31 |
| 10515937 | Semiconductor device and method of manufacture | Jing-Cheng Lin, Po-Hao Tsai, Porter Chen | 2019-12-24 |
| 10510591 | Package-on-package structure and method of manufacturing package | Chin-Fu Kao, Chih-Yuan Chien, Szu-Wei Lu | 2019-12-17 |
| 10504824 | Integrated circuit package and method | Chih-Chien Pan, Chin-Fu Kao, Szu-Wei Lu | 2019-12-10 |
| 10438934 | Package-on-package structure and manufacturing method thereof | Shih-Ting Lin, Chin-Fu Kao, Jing-Cheng Lin, Szu-Wei Lu | 2019-10-08 |
| 10354982 | Integrated fan-out structure with guiding trenches in buffer layer | Po-Hao Tsai, Feng-Cheng Hsu, Jui-Pin Hung, Jing-Cheng Lin | 2019-07-16 |
| 10290610 | PoP device and method of forming the same | Li-Hsien Huang, An-Jhih Su, Der-Chyang Yeh, Hua-Wei Tseng, Po-Hao Tsai +2 more | 2019-05-14 |
| 10269587 | Integrated circuit packages and methods of forming same | Jing-Cheng Lin, Po-Hao Tsai | 2019-04-23 |
| 10170341 | Release film as isolation film in package | Jing-Cheng Lin, Po-Hao Tsai | 2019-01-01 |