Issued Patents 2019
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510732 | PoP device and method of forming the same | Hsien-Ju Tsou, Chih-Wei Wu, Jing-Cheng Lin, Pu Wang, Ying-Ching Shih | 2019-12-17 |
| 10510684 | Three dimensional integrated circuit (3DIC) with support structures | Chih-Wei Wu, Ying-Ching Shih, Jing-Cheng Lin | 2019-12-17 |
| 10510634 | Package structure and method | Jing-Cheng Lin, Chen-Hua Yu | 2019-12-17 |
| 10510595 | Integrated fan-out packages and methods of forming the same | Chih-Wei Wu, Ying-Ching Shih, Jing-Cheng Lin, Long Hua Lee | 2019-12-17 |
| 10510591 | Package-on-package structure and method of manufacturing package | Li-Hui Cheng, Chin-Fu Kao, Chih-Yuan Chien | 2019-12-17 |
| 10504824 | Integrated circuit package and method | Chih-Chien Pan, Li-Hui Cheng, Chin-Fu Kao | 2019-12-10 |
| 10497690 | Semiconductor package, method for forming semiconductor package, and method for forming semiconductor assembly | Hsien-Ju Tsou, Chih-Wei Wu, Pu Wang, Ying-Ching Shih, Jing-Cheng Lin | 2019-12-03 |
| 10490474 | Die-on-interposer assembly with dam structure and method of manufacturing the same | Chih-Wei Wu, Jing-Cheng Lin | 2019-11-26 |
| 10483234 | Chip packages and methods of manufacture thereof | Chih-Wei Wu, Jing-Cheng Lin, Ying-Ching Shih | 2019-11-19 |
| 10438934 | Package-on-package structure and manufacturing method thereof | Shih-Ting Lin, Chin-Fu Kao, Jing-Cheng Lin, Li-Hui Cheng | 2019-10-08 |
| 10347612 | Solution for reducing poor contact in InFO package | Jing-Cheng Lin, Chen-Hua Yu, Shih-Ting Lin, Shin-Puu Jeng | 2019-07-09 |
| 10340253 | Package structure and method of manufacturing the same | Shu-Hang Liao, Chih-Wei Wu, Jing-Cheng Lin, Ying-Ching Shih | 2019-07-02 |
| 10269589 | Method of manufacturing a release film as isolation film in package | Hsien-Ju Tsou, Chih-Wei Wu, Pu Wang, Ying-Ching Shih, Jing-Cheng Lin | 2019-04-23 |
| 10269731 | Apparatus for dicing interposer assembly | Chung Yu Wang, Kung-Chen Yeh, Chih-Wei Wu, Jing-Cheng Lin | 2019-04-23 |
| 10269730 | Methods of manufacturing an integrated circuit having stress tuning layer | Shin-Puu Jeng, Clinton Chao | 2019-04-23 |
| 10170441 | Semiconductor structure and manufacturing method thereof | Chih-Wei Wu, Ying-Ching Shih, Jing-Cheng Lin | 2019-01-01 |
| 10170295 | Flux residue cleaning system and method | I-Ting Chen, Jing-Cheng Lin, Ying-Ching Shih | 2019-01-01 |