Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510732 | PoP device and method of forming the same | Chih-Wei Wu, Jing-Cheng Lin, Pu Wang, Szu-Wei Lu, Ying-Ching Shih | 2019-12-17 |
| 10497690 | Semiconductor package, method for forming semiconductor package, and method for forming semiconductor assembly | Chih-Wei Wu, Pu Wang, Ying-Ching Shih, Szu-Wei Lu, Jing-Cheng Lin | 2019-12-03 |
| 10269589 | Method of manufacturing a release film as isolation film in package | Chih-Wei Wu, Pu Wang, Szu-Wei Lu, Ying-Ching Shih, Jing-Cheng Lin | 2019-04-23 |