Issued Patents 2019
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510732 | PoP device and method of forming the same | Hsien-Ju Tsou, Jing-Cheng Lin, Pu Wang, Szu-Wei Lu, Ying-Ching Shih | 2019-12-17 |
| 10510684 | Three dimensional integrated circuit (3DIC) with support structures | Ying-Ching Shih, Szu-Wei Lu, Jing-Cheng Lin | 2019-12-17 |
| 10510595 | Integrated fan-out packages and methods of forming the same | Ying-Ching Shih, Szu-Wei Lu, Jing-Cheng Lin, Long Hua Lee | 2019-12-17 |
| 10497690 | Semiconductor package, method for forming semiconductor package, and method for forming semiconductor assembly | Hsien-Ju Tsou, Pu Wang, Ying-Ching Shih, Szu-Wei Lu, Jing-Cheng Lin | 2019-12-03 |
| 10490474 | Die-on-interposer assembly with dam structure and method of manufacturing the same | Szu-Wei Lu, Jing-Cheng Lin | 2019-11-26 |
| 10483234 | Chip packages and methods of manufacture thereof | Jing-Cheng Lin, Szu-Wei Lu, Ying-Ching Shih | 2019-11-19 |
| 10340253 | Package structure and method of manufacturing the same | Shu-Hang Liao, Jing-Cheng Lin, Szu-Wei Lu, Ying-Ching Shih | 2019-07-02 |
| 10319780 | Light-emitting element having a plurality of light-emitting structures | Chen Ou, Chun-Wei Chang, Sheng-Chih WANG, Hsin-Mei Tsai, Chia-Chen Tsai +1 more | 2019-06-11 |
| 10290773 | Light-emitting device | Chen Ou, Liang-Sheng Chi, Chun-Wei Chang | 2019-05-14 |
| 10269731 | Apparatus for dicing interposer assembly | Chung Yu Wang, Kung-Chen Yeh, Szu-Wei Lu, Jing-Cheng Lin | 2019-04-23 |
| 10269589 | Method of manufacturing a release film as isolation film in package | Hsien-Ju Tsou, Pu Wang, Szu-Wei Lu, Ying-Ching Shih, Jing-Cheng Lin | 2019-04-23 |
| 10253232 | Method of lubricating a rotary screw compressor | Hsinheng Li, Jeng-Shiang Tsaih, Hsu-Hua Tang, Jung-Tsung Hung, Tai-Her Tsai +1 more | 2019-04-09 |
| 10170441 | Semiconductor structure and manufacturing method thereof | Ying-Ching Shih, Szu-Wei Lu, Jing-Cheng Lin | 2019-01-01 |