YS

Ying-Ching Shih

TSMC: 11 patents #117 of 3,065Top 4%
Overall (2019): #6,594 of 560,194Top 2%
11
Patents 2019

Issued Patents 2019

Showing 1–11 of 11 patents

Patent #TitleCo-InventorsDate
10510732 PoP device and method of forming the same Hsien-Ju Tsou, Chih-Wei Wu, Jing-Cheng Lin, Pu Wang, Szu-Wei Lu 2019-12-17
10510684 Three dimensional integrated circuit (3DIC) with support structures Chih-Wei Wu, Szu-Wei Lu, Jing-Cheng Lin 2019-12-17
10510595 Integrated fan-out packages and methods of forming the same Chih-Wei Wu, Szu-Wei Lu, Jing-Cheng Lin, Long Hua Lee 2019-12-17
10497616 Embedded 3D interposer structure Jing-Cheng Lin, Wen-Chih Chiou, Shin-Puu Jeng, Chen-Hua Yu 2019-12-03
10497690 Semiconductor package, method for forming semiconductor package, and method for forming semiconductor assembly Hsien-Ju Tsou, Chih-Wei Wu, Pu Wang, Szu-Wei Lu, Jing-Cheng Lin 2019-12-03
10483234 Chip packages and methods of manufacture thereof Chih-Wei Wu, Jing-Cheng Lin, Szu-Wei Lu 2019-11-19
10340253 Package structure and method of manufacturing the same Shu-Hang Liao, Chih-Wei Wu, Jing-Cheng Lin, Szu-Wei Lu 2019-07-02
10290609 Semiconductor device and manufacturing method of the same Jing-Cheng Lin, Pu Wang, Chen-Hua Yu 2019-05-14
10269589 Method of manufacturing a release film as isolation film in package Hsien-Ju Tsou, Chih-Wei Wu, Pu Wang, Szu-Wei Lu, Jing-Cheng Lin 2019-04-23
10170295 Flux residue cleaning system and method I-Ting Chen, Jing-Cheng Lin, Szu-Wei Lu 2019-01-01
10170441 Semiconductor structure and manufacturing method thereof Chih-Wei Wu, Szu-Wei Lu, Jing-Cheng Lin 2019-01-01