Issued Patents 2019
Showing 1–25 of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522491 | Semiconductor device and bump formation process | Yi-Li Hsiao, Chen-Hua Yu, Chih-Hang Tung, Cheng-Chang Wei | 2019-12-31 |
| 10522473 | Alignment mark design for packages | Li-Hsien Huang, Hsien-Wei Chen, Ching-Wen Hsiao, Der-Chyang Yeh, Chen-Hua Yu | 2019-12-31 |
| 10515827 | Method for forming chip package with recessed interposer substrate | Po-Hao Tsai, Po-Yao Chuang, Feng-Cheng Hsu, Shuo-Mao Chen, Techi Wong | 2019-12-24 |
| 10515930 | Three-layer package-on-package structure and method forming same | Jui-Pin Hung, Feng-Cheng Hsu | 2019-12-24 |
| 10515829 | Package system for integrated circuits | Wei-Cheng Wu, Shang-Yun Hou, Chen-Hua Yu | 2019-12-24 |
| 10510670 | Pad structure design in fan-out package | Chen-Hua Yu, Der-Chyang Yeh, Hsien-Wei Chen | 2019-12-17 |
| 10510690 | Wafer level package (WLP) and method for forming the same | Hsien-Wen Liu | 2019-12-17 |
| 10510561 | Semiconductor device package including conformal metal cap contacting each semiconductor die | Chen-Yu Tsai, Tsung-Shang Wei, Yu-Sheng Lin, Wen-Chih Chiou | 2019-12-17 |
| 10504752 | Integrated passive device package and methods of forming same | Feng-Cheng Hsu, Shuo-Mao Chen, Jui-Pin Hung | 2019-12-10 |
| 10504880 | Method of forming semicondcutor device package | Po-Yao Lin, Cheng-Yi Hong, Feng-Cheng Hsu, Shuo-Mao Chen, Shu-Shen Yeh +1 more | 2019-12-10 |
| 10497616 | Embedded 3D interposer structure | Ying-Ching Shih, Jing-Cheng Lin, Wen-Chih Chiou, Chen-Hua Yu | 2019-12-03 |
| 10475769 | Semiconductor package and manufacturing method of the same | Feng-Cheng Hsu, Jui-Pin Hung | 2019-11-12 |
| 10475759 | Integrated circuit structure having dies with connectors of different sizes | Chen-Hua Yu, Jing-Cheng Lin | 2019-11-12 |
| RE47709 | Forming grounded through-silicon vias in a semiconductor substrate | Chi-Chun Hsieh, Wei-Cheng Wu, Hsiao-Tsung Yen, Hsien-Pin Hu, Shang-Yun Hou | 2019-11-05 |
| 10468339 | Heterogeneous fan-out structure and method of manufacture | Po-Hao Tsai, Po-Yao Chuang, Techi Wong | 2019-11-05 |
| 10461009 | 3DIC packaging with hot spot thermal management features | Wensen Hung, Szu-Po Huang, Hsiang-Fan Lee, Kim Hong Chen, Chi-Hsi Wu | 2019-10-29 |
| 10446520 | 3D semiconductor package interposer with die cavity | Shang-Yun Hou, Kim Hong Chen, Wensen Hung, Szu-Po Huang | 2019-10-15 |
| 10354988 | Using metal-containing layer to reduce carrier shock in package formation | Hsien-Wen Liu, Yi-Jou Lin | 2019-07-16 |
| 10347612 | Solution for reducing poor contact in InFO package | Jing-Cheng Lin, Chen-Hua Yu, Szu-Wei Lu, Shih-Ting Lin | 2019-07-09 |
| 10347574 | Integrated fan-out packages | Dai-Jang Chen, Hsiang-Tai Lu, Hsien-Wen Liu, Chih-Hsien Lin, Shih-Ting Hung +1 more | 2019-07-09 |
| 10332823 | Packaged semiconductor devices | Kim Hong Chen, Szu-Po Huang, Wensen Hung | 2019-06-25 |
| 10290590 | Stacked semiconductor device and method of manufacturing the same | Tzu-Jui Fang, Hsi-Kuei Cheng, Chih-Kang Han, Yi-Jen Lai, Hsien-Wen Liu +1 more | 2019-05-14 |
| 10290605 | Fan-out package structure and method for forming the same | Hsien-Wen Liu, Po-Yao Chuang, Tzu-Jui Fang, Yi-Jou Lin | 2019-05-14 |
| 10283428 | Semiconductor package and method manufacturing the same | Feng-Cheng Hsu | 2019-05-07 |
| 10283474 | Chip package structure and method for forming the same | Shuo-Mao Chen, Feng-Cheng Hsu | 2019-05-07 |