Issued Patents 2019
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10515867 | Semiconductor structure and manufacturing method thereof | Chi-Hsi Wu, Tsung-Shu Lin, Shih-Chang Ku, Tsung-Yu Chen, Hung-Chi Li | 2019-12-24 |
| 10510687 | Packaging devices and methods for semiconductor devices | — | 2019-12-17 |
| 10483187 | Heat spreading device and method | Chen-Hua Yu, Ming-Fa Chen, Tsung-Yu Chen | 2019-11-19 |
| 10461014 | Heat spreading device and method | Tsung-Shu Lin, Hung-Chi Li, Tsung-Yu Chen | 2019-10-29 |
| 10461009 | 3DIC packaging with hot spot thermal management features | Szu-Po Huang, Hsiang-Fan Lee, Kim Hong Chen, Chi-Hsi Wu, Shin-Puu Jeng | 2019-10-29 |
| 10446520 | 3D semiconductor package interposer with die cavity | Shin-Puu Jeng, Shang-Yun Hou, Kim Hong Chen, Szu-Po Huang | 2019-10-15 |
| 10332823 | Packaged semiconductor devices | Kim Hong Chen, Szu-Po Huang, Shin-Puu Jeng | 2019-06-25 |
| 10269682 | Cooling devices, packaged semiconductor devices, and methods of packaging semiconductor devices | Cheng-Chieh Hsieh, Chi-Hsi Wu, Shin-Puu Jeng, Tsung-Yu Chen | 2019-04-23 |