Issued Patents 2019
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10524392 | Dissipating heat using phase change material | — | 2019-12-31 |
| 10515867 | Semiconductor structure and manufacturing method thereof | Chi-Hsi Wu, Wensen Hung, Tsung-Shu Lin, Shih-Chang Ku, Hung-Chi Li | 2019-12-24 |
| 10483187 | Heat spreading device and method | Chen-Hua Yu, Wensen Hung, Ming-Fa Chen | 2019-11-19 |
| 10461014 | Heat spreading device and method | Tsung-Shu Lin, Wensen Hung, Hung-Chi Li | 2019-10-29 |
| 10269682 | Cooling devices, packaged semiconductor devices, and methods of packaging semiconductor devices | Cheng-Chieh Hsieh, Chi-Hsi Wu, Shin-Puu Jeng, Wensen Hung | 2019-04-23 |