Issued Patents 2019
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10515867 | Semiconductor structure and manufacturing method thereof | Chi-Hsi Wu, Wensen Hung, Shih-Chang Ku, Tsung-Yu Chen, Hung-Chi Li | 2019-12-24 |
| 10483225 | Packaging assembly and method of making the same | Chita Chuang, Yao-Chun Chunag, Chen-Cheng Kuo, Chen-Shien Chen | 2019-11-19 |
| 10461014 | Heat spreading device and method | Wensen Hung, Hung-Chi Li, Tsung-Yu Chen | 2019-10-29 |
| 10453813 | Contact pad for semiconductor device | Chang-Chia Huang, Cheng-Chieh Hsieh, Wei-Cheng Wu | 2019-10-22 |
| 10366959 | Integrated fan-out structure and method of forming | Hsien-Wei Chen, An-Jhih Su | 2019-07-30 |
| 10354961 | Routing design of dummy metal cap and redistribution line | Chen-Hua Yu, Hsien-Wei Chen, Meng-Tsan Lee, Wei-Cheng Wu, Chien-Chia Chiu +1 more | 2019-07-16 |
| 10347606 | Devices employing thermal and mechanical enhanced layers and methods of forming same | Chen-Hua Yu, An-Jhih Su, Wei-Yu Chen, Ying-Ju Chen, Chin-Chuan Chang +5 more | 2019-07-09 |
| 10269738 | Semiconductor device and method of manufacture | Cheng-Hsien Hsieh, Hsien-Wei Chen, Chen-Hua Yu, Wei-Cheng Wu | 2019-04-23 |