Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510674 | Fan-out package having a main die and a dummy die, and method of forming | Yan-Fu Lin, Chen-Hua Yu, Wei-Cheng Wu, Hsien-Wei Chen | 2019-12-17 |
| 10354961 | Routing design of dummy metal cap and redistribution line | Chen-Hua Yu, Hsien-Wei Chen, Tsung-Shu Lin, Wei-Cheng Wu, Chien-Chia Chiu +1 more | 2019-07-16 |