Issued Patents 2019
Showing 1–25 of 76 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522480 | Packaging devices and methods of manufacture thereof | Tsung-Yuan Yu, Ming-Da Cheng, Wen-Hsiung Lu | 2019-12-31 |
| 10522477 | Method of making package assembly including stress relief structures | — | 2019-12-31 |
| 10522473 | Alignment mark design for packages | Li-Hsien Huang, Ching-Wen Hsiao, Der-Chyang Yeh, Shin-Puu Jeng, Chen-Hua Yu | 2019-12-31 |
| 10522481 | Post-passivation interconnect structure | Hao-Yi Tsai, Mirng-Ji Lii, Chen-Hua Yu | 2019-12-31 |
| 10522490 | Semiconductor package and method of forming the same | Chi-Hsi Wu, Der-Chyang Yeh, Jie Chen | 2019-12-31 |
| 10515865 | Underfill control structures and method | Ying-Ju Chen, An-Jhih Su, Der-Chyang Yeh, Chi-Hsi Wu, Chen-Hua Yu | 2019-12-24 |
| 10515922 | Multi-chip integrated fan-out package | Jie Chen | 2019-12-24 |
| 10515915 | Methods of forming connector pad structures, interconnect structures, and structures thereof | Chia-Lun Chang, Chung-Shi Liu, Hsiu-Jen Lin, Ming-Da Cheng, Wei-Yu Chen | 2019-12-24 |
| 10515874 | Semiconductor device and method of manufacture | Chih-Chia Hu, Sen-Bor Jan, Ming-Fa Chen | 2019-12-24 |
| 10510678 | Eliminate sawing-induced peeling through forming trenches | Jie Chen | 2019-12-17 |
| 10510629 | Integrated circuit package and method of forming same | Ming-Fa Chen, Chen-Hua Yu | 2019-12-17 |
| 10510715 | Semiconductor structure and manufacturing method thereof | Chen-Hua Yu, Chi-Hsi Wu, Der-Chyang Yeh, An-Jhih Su, Tien-Chung Yang | 2019-12-17 |
| 10510650 | Method of manufacturing semiconductor device packaging structure having through interposer vias and through substrate vias | Chen-Hua Yu, Sung-Feng Yeh, Ming-Fa Chen, Tzuan-Horng Liu | 2019-12-17 |
| 10510691 | Semiconductor structure and manufacturing method thereof | Tzuan-Horng Liu, Ming-Fa Chen | 2019-12-17 |
| 10510670 | Pad structure design in fan-out package | Chen-Hua Yu, Shin-Puu Jeng, Der-Chyang Yeh | 2019-12-17 |
| 10510654 | Dummy metal with zigzagged edges | Cheng-Hsien Hsieh, Chi-Hsi Wu, Chen-Hua Yu, Der-Chyang Yeh, Li-Han Hsu +1 more | 2019-12-17 |
| 10510674 | Fan-out package having a main die and a dummy die, and method of forming | Yan-Fu Lin, Chen-Hua Yu, Meng-Tsan Lee, Wei-Cheng Wu | 2019-12-17 |
| 10510562 | Stacked semiconductor devices and methods of forming same | Der-Chyang Yeh, Li-Hsien Huang | 2019-12-17 |
| 10510635 | Integrated circuit packages and methods for forming the same | Chia-Wei Tu, Tsung-Fu Tsai, Wen-Hsiung Lu, Yian-Liang Kuo | 2019-12-17 |
| 10510556 | Integrated circuit package pad and methods of forming | Chen-Hua Yu, Chi-Hsi Wu, Der-Chyang Yeh, An-Jhih Su, Wei-Yu Chen | 2019-12-17 |
| 10510668 | Method of fabricating semiconductor device | Jie Chen | 2019-12-17 |
| 10504873 | 3DIC structure with protective structure and method of fabricating the same and package | Ching-Jung Yang, Ming-Fa Chen | 2019-12-10 |
| 10504877 | Surface mount device/integrated passive device on package or device structure and methods of forming | Cheng-Hsien Hsieh, Chi-Hsi Wu, Chen-Hua Yu, Der-Chyang Yeh, Wei-Cheng Wu | 2019-12-10 |
| 10504751 | Package structures and method of forming the same | Cheng-Hsien Hsieh, Li-Han Hsu, Lai Wei Chih | 2019-12-10 |
| 10504852 | Three-dimensional integrated circuit structures | Jie Chen, Ying-Ju Chen | 2019-12-10 |