Issued Patents 2019
Showing 1–25 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522481 | Post-passivation interconnect structure | Hsien-Wei Chen, Mirng-Ji Lii, Chen-Hua Yu | 2019-12-31 |
| 10510713 | Semicondcutor package and method of manufacturing the same | Shih-Wei Chen, Chih-Hua Chen, Hsin-Yu Pan, Lipu Kris Chuang, Tin-Hao Kuo | 2019-12-17 |
| 10510686 | Semiconductor package and manufacturing method thereof | Po-Yuan Teng, Tin-Hao Kuo, Ching-Yao Lin, Teng-Yuan Lo, Chih-Lin Wang | 2019-12-17 |
| 10510652 | Method of manufacturing semiconductor device | Tsung-Yuan Yu, Chao-Wen Shih, Hung-Yi Kuo, Pi-Lan Chang | 2019-12-17 |
| 10510631 | Fan out package structure and method of manufacturing the same | Chih-Hsuan Tai, Chih-Hua Chen, Yu-Chih Huang, Chia-Hung Liu, Ting-Ting Kuo | 2019-12-17 |
| 10510478 | Stacked coil for wireless charging structure on InFO package | Chen-Hua Yu, Tzu-Chun Tang, Chuei-Tang Wang, Ming Hung Tseng, Chieh-Yen Chen +1 more | 2019-12-17 |
| 10509938 | Fingerprint sensor device and method | Chen-Hua Yu, Yu-Feng Chen, Chih-Hua Chen, Chung-Shi Liu | 2019-12-17 |
| 10504810 | Polymer-based-semiconductor structure with cavity | Chen-Hua Yu, Hung-Yi Kuo | 2019-12-10 |
| 10497646 | Dual-mode wireless charging device | Shih-Wei Liang, Hung-Yi Kuo, Ming Hung Tseng, Hsien-Ming Tu | 2019-12-03 |
| 10490468 | Semiconductor structure with conductive structure | Pei-Chun Tsai, Wei Sen Chang, Tin-Hao Kuo | 2019-11-26 |
| 10475755 | Semiconductor structure | Vincent Chen, Hung-Yi Kuo, Chuei-Tang Wang, Chen-Hua Yu, Wei-Ting Chen +2 more | 2019-11-12 |
| 10461023 | Semiconductor packages and methods of forming the same | Mao-Yen Chang, Kuo Lung Pan, Tin-Hao Kuo, Tzung-Hui Lee, Teng-Yuan Lo +1 more | 2019-10-29 |
| 10453815 | Methods and apparatus for solder connections | Chen-Hua Yu, Chien-Hsiun Lee, Chung-Shi Liu, Hsien-Wei Chen | 2019-10-22 |
| 10354114 | Fingerprint sensor in InFO structure and formation method | Chih-Hua Chen, Yu-Feng Chen, Chung-Shi Liu, Chen-Hua Yu, Yu-Chih Huang | 2019-07-16 |
| 10340236 | Semiconductor device and method of manufacture | Chen-Hua Yu, Tin-Hao Kuo, Chung-Shi Liu | 2019-07-02 |
| 10319692 | Semiconductor structure and manufacturing method thereof | Yung-Ping Chiang, Chao-Wen Shih, Mirng-Ji Lii | 2019-06-11 |
| 10312204 | System and method for an improved interconnect structure | Hsien-Wei Chen, Mirng-Ji Lii, Chen-Hua Yu, Tsung-Yuan Yu | 2019-06-04 |
| 10304614 | Stacked coil for wireless charging structure on InFO package | Chen-Hua Yu, Tzu-Chun Tang, Chuei-Tang Wang, Ming Hung Tseng, Chieh-Yen Chen +1 more | 2019-05-28 |
| 10276509 | Integrated fan-out package | Chih-Hao Chang, Hsin-Hung Liao, Chien Ling Hwang, Wei Sen Chang, Tsung-Hsien Chiang +1 more | 2019-04-30 |
| 10276402 | Semiconductor package and manufacturing process thereof | Yu-Feng Chen, Chih-Hua Chen, Chen-Hua Yu, Chung-Shi Liu, Hung-Jui Kuo +1 more | 2019-04-30 |
| 10269674 | Method of manufacturing an integrated fan-out package having fan-out redistribution layer (RDL) to accommodate electrical connectors | Chen-Hua Yu, Kuo-Chung Yee, Tin-Hao Kuo | 2019-04-23 |
| 10269489 | Programmable inductor | Chen-Hua Yu, Mirng-Ji Lii, Hsien-Wei Chen, Hung-Yi Kuo, Nien-Fang Wu | 2019-04-23 |
| 10269481 | Stacked coil for wireless charging structure on InFO package | Chen-Hua Yu, Tzu-Chun Tang, Chuei-Tang Wang, Ming Hung Tseng, Chieh-Yen Chen +1 more | 2019-04-23 |
| 10268868 | Fingerprint sensor device and method | Chen-Hua Yu, Yu-Feng Chen, Chih-Hua Chen, Chung-Shi Liu | 2019-04-23 |
| 10268872 | Fingerprint sensor device and method | Yu-Chih Huang, Chih-Hua Chen, Yu-Jen Cheng, Chih-Wei Lin, Yu-Feng Chen +2 more | 2019-04-23 |