Issued Patents 2019
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10515900 | Chip package with fan-out structure | Shing-Chao Chen, Chih-Wei Lin, Ming-Da Cheng, Ching-Hua Hsieh | 2019-12-24 |
| 10468366 | Bonded structures for package and substrate | Ming-Hong Cha, Chen-Shien Chen, Chen-Cheng Kuo, Hao-Juin Liu, Yao-Chun Chuang +1 more | 2019-11-05 |
| 10276509 | Integrated fan-out package | Chih-Hao Chang, Hsin-Hung Liao, Hao-Yi Tsai, Chien Ling Hwang, Wei Sen Chang +1 more | 2019-04-30 |
| 10269676 | Thermally enhanced package-on-package (PoP) | Ming Hung Tseng, Chen-Shien Chen | 2019-04-23 |
| 10269702 | Info coil structure and methods of manufacturing same | Chen-Hua Yu, Hao-Yi Tsai, Hung-Yi Kuo, Ming Hung Tseng | 2019-04-23 |
| 10177073 | Wafer level embedded heat spreader | Wei Sen Chang, Yen-Chang Hu, Ching-Wen Hsiao | 2019-01-08 |