Issued Patents 2019
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10515917 | Bump on pad (BOP) bonding structure in semiconductor packaged device | Yao-Chun Chuang, Chita Chuang, Chen-Shien Chen | 2019-12-24 |
| 10510644 | Package structures and methods for forming the same | Ching-Wen Hsiao, Ming-Da Cheng, Chih-Wei Lin, Chen-Shien Chen, Chih-Hua Chen | 2019-12-17 |
| 10483225 | Packaging assembly and method of making the same | Chita Chuang, Yao-Chun Chunag, Tsung-Shu Lin, Chen-Shien Chen | 2019-11-19 |
| 10468366 | Bonded structures for package and substrate | Ming-Hong Cha, Chen-Shien Chen, Tsung-Hsien Chiang, Hao-Juin Liu, Yao-Chun Chuang +1 more | 2019-11-05 |
| 10304700 | Semiconductor device and method | Zi-Jheng Liu, Yu-Hsiang Hu, Jo-Lin Lan, Shih-Hao Liao, Hung-Jui Kuo +3 more | 2019-05-28 |
| 10276428 | Semiconductor package and method of fabricating semiconductor package | Zi-Jheng Liu, Hung-Jui Kuo | 2019-04-30 |