Issued Patents 2019
Showing 1–25 of 30 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522501 | Semiconductor structure and method of forming the same | Hui-Jung Tsai, Yun Chen Hsieh, Jyun-Siang Peng, Tai-Min Chang, Yi-Yang Lei +1 more | 2019-12-31 |
| 10522440 | Package structure and method of manufacturing the same | Po-Han Wang, Yu-Hsiang Hu | 2019-12-31 |
| 10515848 | Semiconductor package and method | Yun Chen Hsieh, Hui-Jung Tsai | 2019-12-24 |
| 10510698 | Semiconductor structure and method of forming | Chen-Hua Yu, Yu-Hsiang Hu | 2019-12-17 |
| 10510673 | Integrated fan-out package and method of fabricating the same | Yu-Hsiang Hu, Yi-Wen Wu | 2019-12-17 |
| 10510646 | Packae structure, RDL structure and method of forming the same | Tzung-Hui Lee, Ming-Che Ho | 2019-12-17 |
| 10510645 | Planarizing RDLs in RDL-first processes through CMP process | Po-Han Wang, Yu-Hsiang Hu, Chen-Hua Yu | 2019-12-17 |
| 10510706 | Package structure and method of fabricating the same | Wei-Chih Chen, Yu-Hsiang Hu, Sih-Hao Liao, Po-Han Wang | 2019-12-17 |
| 10510704 | Package structure and method of manufacturing the same | Wei-Chih Chen, Yu-Hsiang Hu, Sih-Hao Liao | 2019-12-17 |
| 10490521 | Advanced structure for info wafer warpage reduction | Yu-Hsiang Hu, Chung-Shi Liu | 2019-11-26 |
| 10461051 | Via structure for packaging and a method of forming | Ming-Che Ho, Yi-Wen Wu, Chien Ling Hwang, Chung-Shi Liu | 2019-10-29 |
| 10446521 | Integrated fan-out package and method of fabricating an integrated fan-out package | Yu-Hsiang Hu, Sih-Hao Liao | 2019-10-15 |
| 10361139 | Semicondcutor package and manufacturing method thereof | Shih-Hao Tseng, Ming-Che Ho, Chia-Hung Liu | 2019-07-23 |
| 10361122 | Processes for reducing leakage and improving adhesion | Yun Chen Hsieh, Hui-Jung Tsai, Chen-Hua Yu | 2019-07-23 |
| 10340206 | Dense redistribution layers in semiconductor packages and methods of forming the same | Chen-Hua Yu, Hui-Jung Tsai | 2019-07-02 |
| 10332856 | Package structure and method of fabricating the same | Wei-Chih Chen, Yu-Hsiang Hu, Sih-Hao Liao, Po-Han Wang | 2019-06-25 |
| 10304700 | Semiconductor device and method | Zi-Jheng Liu, Yu-Hsiang Hu, Jo-Lin Lan, Shih-Hao Liao, Chen-Cheng Kuo +3 more | 2019-05-28 |
| 10297560 | Semiconductor device and method | Chen-Hua Yu, Ming-Che Ho, Yi-Wen Wu, Tzung-Hui Lee | 2019-05-21 |
| 10297551 | Method of manufacturing redistribution circuit structure and method of manufacturing integrated fan-out package | Hui-Jung Tsai, Yun Chen Hsieh | 2019-05-21 |
| 10297544 | Integrated fan-out package and method of fabricating the same | Yi-Wen Wu, Ming-Che Ho | 2019-05-21 |
| 10283461 | Info structure and method forming same | Po-Han Wang, Yu-Hsiang Hu, Chen-Hua Yu | 2019-05-07 |
| 10276421 | Integrated fan-out package, integrated fan-out package array, and method of manufacturing integrated fan-out packages | Sih-Hao Liao, Yu-Hsiang Hu | 2019-04-30 |
| 10276543 | Semicondcutor device package and method of forming semicondcutor device package | Sih-Hao Liao, Yu-Hsiang Hu | 2019-04-30 |
| 10276428 | Semiconductor package and method of fabricating semiconductor package | Zi-Jheng Liu, Chen-Cheng Kuo | 2019-04-30 |
| 10276402 | Semiconductor package and manufacturing process thereof | Yu-Feng Chen, Chih-Hua Chen, Chen-Hua Yu, Chung-Shi Liu, Hui-Jung Tsai +1 more | 2019-04-30 |