Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510646 | Packae structure, RDL structure and method of forming the same | Hung-Jui Kuo, Ming-Che Ho | 2019-12-17 |
| 10461023 | Semiconductor packages and methods of forming the same | Mao-Yen Chang, Hao-Yi Tsai, Kuo Lung Pan, Tin-Hao Kuo, Teng-Yuan Lo +1 more | 2019-10-29 |
| 10297560 | Semiconductor device and method | Chen-Hua Yu, Ming-Che Ho, Hung-Jui Kuo, Yi-Wen Wu | 2019-05-21 |