Issued Patents 2019
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510646 | Packae structure, RDL structure and method of forming the same | Tzung-Hui Lee, Hung-Jui Kuo | 2019-12-17 |
| 10501660 | Method of selectively removing tungsten over silicon oxide | Yun-Lung Ho, Chung-Wei Chiang, Song-Yuan Chang, Ming-Hui Lu | 2019-12-10 |
| 10483230 | Bonding package components through plating | Zheng-Yi Lim, Yi-Wen Wu, Tzong-Hann Yang, Chung-Shi Liu | 2019-11-19 |
| 10461051 | Via structure for packaging and a method of forming | Yi-Wen Wu, Chien Ling Hwang, Hung-Jui Kuo, Chung-Shi Liu | 2019-10-29 |
| 10423848 | Method, system, and computer-readable recording medium for long-distance person identification | You-Jyun Syu, Ching-An Cho | 2019-09-24 |
| 10361139 | Semicondcutor package and manufacturing method thereof | Shih-Hao Tseng, Hung-Jui Kuo, Chia-Hung Liu | 2019-07-23 |
| 10297560 | Semiconductor device and method | Chen-Hua Yu, Hung-Jui Kuo, Yi-Wen Wu, Tzung-Hui Lee | 2019-05-21 |
| 10297544 | Integrated fan-out package and method of fabricating the same | Yi-Wen Wu, Hung-Jui Kuo | 2019-05-21 |
| 10235576 | Analysis method of lane stripe images, image analysis device, and non-transitory computer readable medium thereof | Shang-Min YEH, Yu-Wen Huang, Yueh-Chi Hung, Yi-Sheng Chao | 2019-03-19 |