Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10483230 | Bonding package components through plating | Yi-Wen Wu, Tzong-Hann Yang, Ming-Che Ho, Chung-Shi Liu | 2019-11-19 |
ZL
Zheng-Yi Lim
Overall (2019): #201,249 of 560,194Top 40%
1
Patents 2019