Issued Patents 2019
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510673 | Integrated fan-out package and method of fabricating the same | Yu-Hsiang Hu, Hung-Jui Kuo | 2019-12-17 |
| 10483230 | Bonding package components through plating | Zheng-Yi Lim, Tzong-Hann Yang, Ming-Che Ho, Chung-Shi Liu | 2019-11-19 |
| 10461051 | Via structure for packaging and a method of forming | Ming-Che Ho, Chien Ling Hwang, Hung-Jui Kuo, Chung-Shi Liu | 2019-10-29 |
| 10297544 | Integrated fan-out package and method of fabricating the same | Hung-Jui Kuo, Ming-Che Ho | 2019-05-21 |
| 10297560 | Semiconductor device and method | Chen-Hua Yu, Ming-Che Ho, Hung-Jui Kuo, Tzung-Hui Lee | 2019-05-21 |