Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10483230 | Bonding package components through plating | Zheng-Yi Lim, Yi-Wen Wu, Ming-Che Ho, Chung-Shi Liu | 2019-11-19 |
TY
Tzong-Hann Yang
Overall (2019): #234,255 of 560,194Top 45%
1
Patents 2019