Issued Patents 2019
Showing 1–25 of 56 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10515915 | Methods of forming connector pad structures, interconnect structures, and structures thereof | Chia-Lun Chang, Hsiu-Jen Lin, Hsien-Wei Chen, Ming-Da Cheng, Wei-Yu Chen | 2019-12-24 |
| 10513070 | Wafer level transfer molding and apparatus for performing the same | Bor-Ping Jang, Yeong-Jyh Lin, Chien Ling Hwang, Meng-Tse Chen, Ming-Da Cheng +1 more | 2019-12-24 |
| 10510709 | Semicondcutor package and manufacturing method thereof | Meng-Tse Chen, Ching-Hua Hsieh, Chih-Wei Lin | 2019-12-17 |
| 10509938 | Fingerprint sensor device and method | Chen-Hua Yu, Yu-Feng Chen, Chih-Hua Chen, Hao-Yi Tsai | 2019-12-17 |
| 10512124 | Warpage control in the packaging of integrated circuits | Ming-Da Cheng, Hsiu-Jen Lin, Cheng-Ting Chen, Wei-Yu Chen, Chien-Wei Lee | 2019-12-17 |
| 10510697 | Semiconductor package system and method | Hui-Min Huang, Chih-Wei Lin, Tsai-Tsung Tsai, Ming-Da Cheng, Chen-Hua Yu | 2019-12-17 |
| 10510716 | Packaged semiconductor devices and methods of packaging semiconductor devices | Chen-Hua Yu, Chih-Fan Huang, Hui-Min Huang, Wei-Hung Lin, Ming-Da Cheng | 2019-12-17 |
| 10510630 | Molding structure for wafer level package | Chen-Hua Yu, Chih-Fan Huang, Chih-Wei Lin, Wei-Hung Lin, Ming-Da Cheng | 2019-12-17 |
| 10510731 | Package-on-package (PoP) structure including stud bulbs | Chen-Hua Yu, Mirng-Ji Lii, Ming-Da Cheng | 2019-12-17 |
| 10510712 | Methods for controlling warpage in packaging | Chien Ling Hwang, Bor-Ping Jang, Hsin-Hung Liao, Yeong-Jyh Lin, Hsiao-Chung Liang | 2019-12-17 |
| 10510719 | Methods of packaging semiconductor devices and packaged semiconductor devices | Chen-Hua Yu, Meng-Tse Chen, Hui-Min Huang, Chih-Fan Huang, Ming-Da Cheng | 2019-12-17 |
| 10504858 | Package structure and method of fabricating the same | Meng-Tse Chen, Ching-Hua Hsieh, Chih-Wei Lin, Hao-Cheng Hou, Jung Wei Cheng | 2019-12-10 |
| 10504870 | Mechanisms for forming bonding structures | Yeong-Jyh Lin, Hsin-Hung Liao, Chien Ling Hwang, Bor-Ping Jang, Hsiao-Chung Liang | 2019-12-10 |
| 10490539 | Package on-package structure including a thermal isolation material and method of forming the same | Meng-Tse Chen, Kuei-Wei Huang, Tsai-Tsung Tsai, Ai-Tee Ang, Ming-Da Cheng | 2019-11-26 |
| 10490521 | Advanced structure for info wafer warpage reduction | Yu-Hsiang Hu, Hung-Jui Kuo | 2019-11-26 |
| 10483230 | Bonding package components through plating | Zheng-Yi Lim, Yi-Wen Wu, Tzong-Hann Yang, Ming-Che Ho | 2019-11-19 |
| 10483617 | Package structure | Nan-Chin Chuang, Chen-Hua Yu, Chao-Wen Shih, Shou-Zen Chang | 2019-11-19 |
| 10475679 | Semiconductor processing boat design with pressure sensor | Ai-Tee Ang, Hsiu-Jen Lin, Wei-Hung Lin, Ming-Da Cheng | 2019-11-12 |
| 10475764 | Die bonder and methods of using the same | Chen-Hua Yu, Shing-Chao Chen, Ming-Da Cheng | 2019-11-12 |
| 10468377 | Device package including molding compound having non-planar top surface around a die | Chen-Hua Yu, Meng-Tse Chen, Ming-Da Cheng | 2019-11-05 |
| 10461051 | Via structure for packaging and a method of forming | Ming-Che Ho, Yi-Wen Wu, Chien Ling Hwang, Hung-Jui Kuo | 2019-10-29 |
| 10461022 | Semiconductor package structure and manufacturing method thereof | Jiun Yi Wu, Chen-Hua Yu, Chien-Hsun Lee | 2019-10-29 |
| 10453815 | Methods and apparatus for solder connections | Chen-Hua Yu, Hao-Yi Tsai, Chien-Hsiun Lee, Hsien-Wei Chen | 2019-10-22 |
| 10373941 | Package-on-package structures and methods for forming the same | Kuei-Wei Huang, Chih-Wei Lin, Hsiu-Jen Lin, Wei-Hung Lin, Ming-Da Cheng | 2019-08-06 |
| 10354964 | Integrated devices in semiconductor packages and methods of forming same | Chen-Hua Yu, Kai-Chiang Wu, Shou-Zen Chang, Chao-Wen Shih | 2019-07-16 |