Issued Patents 2019
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522495 | Protrusion bump pads for bond-on-trace processing | Yu-Min Liang | 2019-12-31 |
| 10461022 | Semiconductor package structure and manufacturing method thereof | Chen-Hua Yu, Chung-Shi Liu, Chien-Hsun Lee | 2019-10-29 |
| 10354983 | Integrated circuit package and methods of forming same | Chen-Hua Yu, Kuo-Chung Yee, Mirng-Ji Lii, Chien-Hsun Lee | 2019-07-16 |
| 10319607 | Package-on-package structure with organic interposer | Yu-Min Liang, Mirng-Ji Lii, Chien-Hsun Lee, Tsung-Ding Wang, Jung Wei Cheng | 2019-06-11 |
| 10319655 | POP structures with dams encircling air gaps and methods for forming the same | Chen-Hua Yu, Tsung-Ding Wang, Chen-Shien Chen, Chung-Shi Liu | 2019-06-11 |