Issued Patents 2019
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522486 | Connector formation methods and packaged semiconductor devices | Jung Wei Cheng, Hai-Ming Chen, Chien-Hsun Lee, Hao-Cheng Hou, Hung-Jen Lin +2 more | 2019-12-31 |
| 10515931 | System in package and method of fabricating same | Chien-Hsun Lee | 2019-12-24 |
| 10483132 | Post-passivation interconnect structure and method of forming the same | Hung-Jen Lin, Chien-Hsun Lee | 2019-11-19 |
| 10319607 | Package-on-package structure with organic interposer | Jiun Yi Wu, Yu-Min Liang, Mirng-Ji Lii, Chien-Hsun Lee, Jung Wei Cheng | 2019-06-11 |
| 10319655 | POP structures with dams encircling air gaps and methods for forming the same | Chen-Hua Yu, Chen-Shien Chen, Chung-Shi Liu, Jiun Yi Wu | 2019-06-11 |
| 10192848 | Package assembly | Hung-Jen Lin, Chien-Hsiun Lee, Wen-Hsiung Lu, Ming-Da Cheng, Chung-Shi Liu | 2019-01-29 |