Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522486 | Connector formation methods and packaged semiconductor devices | Jung Wei Cheng, Hai-Ming Chen, Chien-Hsun Lee, Hao-Cheng Hou, Chun-Chih Chuang +2 more | 2019-12-31 |
| 10483132 | Post-passivation interconnect structure and method of forming the same | Tsung-Ding Wang, Chien-Hsun Lee | 2019-11-19 |
| 10192848 | Package assembly | Tsung-Ding Wang, Chien-Hsiun Lee, Wen-Hsiung Lu, Ming-Da Cheng, Chung-Shi Liu | 2019-01-29 |