Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522486 | Connector formation methods and packaged semiconductor devices | Jung Wei Cheng, Hai-Ming Chen, Chien-Hsun Lee, Hung-Jen Lin, Chun-Chih Chuang +2 more | 2019-12-31 |
| 10504858 | Package structure and method of fabricating the same | Meng-Tse Chen, Ching-Hua Hsieh, Chung-Shi Liu, Chih-Wei Lin, Jung Wei Cheng | 2019-12-10 |