Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522486 | Connector formation methods and packaged semiconductor devices | Jung Wei Cheng, Hai-Ming Chen, Chien-Hsun Lee, Hao-Cheng Hou, Hung-Jen Lin +2 more | 2019-12-31 |
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Chun-Chih Chuang
Overall (2019): #515,704 of 560,194Top 95%
1
Patents 2019