Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522436 | Planarization of semiconductor packages and structures resulting therefrom | Chi-Yang Yu, Yu-Min Liang, Jung Wei Cheng, Chien-Hsun Lee | 2019-12-31 |
| 10522486 | Connector formation methods and packaged semiconductor devices | Jung Wei Cheng, Chien-Hsun Lee, Hao-Cheng Hou, Hung-Jen Lin, Chun-Chih Chuang +2 more | 2019-12-31 |