Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522436 | Planarization of semiconductor packages and structures resulting therefrom | Hai-Ming Chen, Yu-Min Liang, Jung Wei Cheng, Chien-Hsun Lee | 2019-12-31 |
| 10468307 | Semiconductor structure and manufacturing method thereof | Chien-Kuo Chang, Chih-Hao Lin, Jung-Tsung Cheng, Kuan-Lin Ho | 2019-11-05 |
| 10276508 | Semiconductor packages and methods of forming the same | Kuan-Lin Ho, Chin-Liang Chen, Yu-Min Liang | 2019-04-30 |
| 10269679 | Semiconductor structure and associated method for manufacturing the same | Chin-Liang Chen, Kuan-Lin Ho, Yu-Min Liang | 2019-04-23 |