Issued Patents 2019
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10515941 | Methods of forming package-on-package structures | Yu-Chih Liu, Wei-Ting Lin, Chin-Liang Chen, Jing Ruei Lu | 2019-12-24 |
| 10468307 | Semiconductor structure and manufacturing method thereof | Chi-Yang Yu, Chien-Kuo Chang, Chih-Hao Lin, Jung-Tsung Cheng | 2019-11-05 |
| 10276508 | Semiconductor packages and methods of forming the same | Chin-Liang Chen, Chi-Yang Yu, Yu-Min Liang | 2019-04-30 |
| 10269668 | System and method for bonding package lid | Shih-Yen Lin, Yu-Chih Liu, Chin-Liang Chen, Wei-Ting Lin | 2019-04-23 |
| 10269679 | Semiconductor structure and associated method for manufacturing the same | Chin-Liang Chen, Chi-Yang Yu, Yu-Min Liang | 2019-04-23 |