Issued Patents 2019
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10505052 | Semiconductor device with transition metal dichalocogenide hetero-structure | Chi-Wen Liu, Chong-Rong Wu, Xiang-Rui Chang | 2019-12-10 |
| 10403744 | Semiconductor devices comprising 2D-materials and methods of manufacture thereof | Samuel C. Pan, Chong-Rong Wu, Xian-Rui Chang | 2019-09-03 |
| 10269564 | Method of forming a semiconductor device using layered etching and repairing of damaged portions | Kuan-Chao CHEN, Si-Chen Lee, Samuel C. Pan | 2019-04-23 |
| 10269668 | System and method for bonding package lid | Yu-Chih Liu, Chin-Liang Chen, Wei-Ting Lin, Kuan-Lin Ho | 2019-04-23 |
| 10269902 | Semiconductor device and method of formation | Meng-Yu Lin, Si-Chen Lee | 2019-04-23 |