Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10269564 | Method of forming a semiconductor device using layered etching and repairing of damaged portions | Shih-Yen Lin, Si-Chen Lee, Samuel C. Pan | 2019-04-23 |
KC
Kuan-Chao CHEN
National Taiwan University: 1 patents #32 of 172Top 20%
Overall (2019): #379,579 of 560,194Top 70%
1
Patents 2019