Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10515941 | Methods of forming package-on-package structures | Yu-Chih Liu, Kuan-Lin Ho, Wei-Ting Lin, Chin-Liang Chen | 2019-12-24 |
| 10269763 | Package-on-package structure having polymer-based material for warpage control | Meng-Tse Chen, Yu-Chih Liu, Hui-Min Huang, Wei-Hung Lin, Ming-Da Cheng +1 more | 2019-04-23 |