Issued Patents 2019
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522234 | Bit tagging method, memory control circuit unit and memory storage device | Yu-Hsiang Lin, Yu-Cheng Hsu | 2019-12-31 |
| 10522452 | Packaging methods for semiconductor devices including forming trenches in workpiece to separate adjacent packaging substrates | Kuei-Wei Huang, Chih-Wei Lin, Chun-Cheng Lin, Meng-Tse Chen, Ming-Da Cheng +1 more | 2019-12-31 |
| 10510630 | Molding structure for wafer level package | Chen-Hua Yu, Chung-Shi Liu, Chih-Fan Huang, Chih-Wei Lin, Ming-Da Cheng | 2019-12-17 |
| 10510716 | Packaged semiconductor devices and methods of packaging semiconductor devices | Chen-Hua Yu, Chung-Shi Liu, Chih-Fan Huang, Hui-Min Huang, Ming-Da Cheng | 2019-12-17 |
| 10475679 | Semiconductor processing boat design with pressure sensor | Ai-Tee Ang, Hsiu-Jen Lin, Ming-Da Cheng, Chung-Shi Liu | 2019-11-12 |
| 10445002 | Data accessing method, memory controlling circuit unit and memory storage device | An-Cheng Liu, Lih Yuarn Ou, Szu-Wei Chen | 2019-10-15 |
| 10424391 | Decoding method, memory controlling circuit unit and memory storage device | Yu-Cheng Hsu, Szu-Wei Chen, Yu-Siang Yang | 2019-09-24 |
| 10409674 | Decoding method, memory control circuit unit and memory storage apparatus | Tien-Ching Wang, Kuo-Hsin Lai | 2019-09-10 |
| 10373941 | Package-on-package structures and methods for forming the same | Kuei-Wei Huang, Chih-Wei Lin, Hsiu-Jen Lin, Ming-Da Cheng, Chung-Shi Liu | 2019-08-06 |
| 10373931 | Semiconductor package structure and method of manufacturing the same | Jeng-Nan Hung, Chun-Hui Yu, Kuo-Chung Yee, Yi-Da Tsai, Ming-Da Cheng +1 more | 2019-08-06 |
| 10310941 | Data encoding method, memory control circuit unit and memory storage device | Chih-Kang Yeh, Yu-Cheng Hsu, Szu-Wei Chen | 2019-06-04 |
| 10283427 | Molding structure for wafer level package | Chen-Hua Yu, Chung-Shi Liu, Chih-Fan Huang, Chih-Wei Lin, Ming-Da Cheng | 2019-05-07 |
| 10269763 | Package-on-package structure having polymer-based material for warpage control | Meng-Tse Chen, Yu-Chih Liu, Hui-Min Huang, Jing Ruei Lu, Ming-Da Cheng +1 more | 2019-04-23 |
| 10269673 | Packaged semiconductor devices and methods of packaging semiconductor devices | Chen-Hua Yu, Chung-Shi Liu, Chih-Fan Huang, Chih-Wei Lin, Ming-Da Cheng | 2019-04-23 |
| 10192804 | Bump-on-trace packaging structure and method for forming the same | Meng-Tse Chen, Chih-Wei Lin, Kuei-Wei Huang, Hui-Min Huang, Ming-Da Cheng +1 more | 2019-01-29 |
| 10177104 | Package on package structure and method for forming the same | Chen-Hua Yu, Chung-Shi Liu, Ming-Da Cheng, Mirng-Ji Lii, Meng-Tse Chen | 2019-01-08 |
| 10170434 | Warpage control in package-on-package structures | Wei-Yu Chen, Yu-Hsiang Hu, Ming-Da Cheng, Chung-Shi Liu | 2019-01-01 |