Issued Patents 2019
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522452 | Packaging methods for semiconductor devices including forming trenches in workpiece to separate adjacent packaging substrates | Wei-Hung Lin, Chih-Wei Lin, Chun-Cheng Lin, Meng-Tse Chen, Ming-Da Cheng +1 more | 2019-12-31 |
| 10490539 | Package on-package structure including a thermal isolation material and method of forming the same | Meng-Tse Chen, Tsai-Tsung Tsai, Ai-Tee Ang, Ming-Da Cheng, Chung-Shi Liu | 2019-11-26 |
| 10373941 | Package-on-package structures and methods for forming the same | Chih-Wei Lin, Hsiu-Jen Lin, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2019-08-06 |
| 10297579 | Package on-package structure with epoxy flux residue | Chen-Hua Yu, Wei-Yu Chen, Hsiu-Jen Lin, Ming-Da Cheng, Ching-Hua Hsieh +2 more | 2019-05-21 |
| 10192804 | Bump-on-trace packaging structure and method for forming the same | Meng-Tse Chen, Wei-Hung Lin, Chih-Wei Lin, Hui-Min Huang, Ming-Da Cheng +1 more | 2019-01-29 |