Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10490539 | Package on-package structure including a thermal isolation material and method of forming the same | Meng-Tse Chen, Kuei-Wei Huang, Tsai-Tsung Tsai, Ming-Da Cheng, Chung-Shi Liu | 2019-11-26 |
| 10475679 | Semiconductor processing boat design with pressure sensor | Hsiu-Jen Lin, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2019-11-12 |
| 10276537 | Integrated fan-out package and manufacturing method thereof | Shing-Chao Chen, Ching-Hua Hsieh, Chih-Wei Lin, Ching-Yao Lin | 2019-04-30 |