Issued Patents 2019
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10515900 | Chip package with fan-out structure | Shing-Chao Chen, Chih-Wei Lin, Tsung-Hsien Chiang, Ming-Da Cheng | 2019-12-24 |
| 10515788 | Systems and methods for integrated resputtering in a physical vapor deposition chamber | Shing-Chyang Pan, Ming-Hsing Tsai, Syun-Ming Jang | 2019-12-24 |
| 10510709 | Semicondcutor package and manufacturing method thereof | Meng-Tse Chen, Chung-Shi Liu, Chih-Wei Lin | 2019-12-17 |
| 10504858 | Package structure and method of fabricating the same | Meng-Tse Chen, Chung-Shi Liu, Chih-Wei Lin, Hao-Cheng Hou, Jung Wei Cheng | 2019-12-10 |
| 10438922 | Method and system for mounting components in semiconductor fabrication process | Chien Ling Hwang, Hsin-Hung Liao, Yu-Ting Chiu | 2019-10-08 |
| 10373931 | Semiconductor package structure and method of manufacturing the same | Jeng-Nan Hung, Chun-Hui Yu, Kuo-Chung Yee, Yi-Da Tsai, Wei-Hung Lin +1 more | 2019-08-06 |
| 10366966 | Method of manufacturing integrated fan-out package | Albert Wan, Chung-Hao Tsai, Chuei-Tang Wang, Chao-Wen Shih, Han-Ping Pu +5 more | 2019-07-30 |
| 10325883 | Package-on-package structure and method | Sheng-Hsiang Chiu, Meng-Tse Chen, Chung-Shi Liu, Sheng-Feng Weng, Ming-Da Cheng | 2019-06-18 |
| 10297579 | Package on-package structure with epoxy flux residue | Chen-Hua Yu, Wei-Yu Chen, Kuei-Wei Huang, Hsiu-Jen Lin, Ming-Da Cheng +2 more | 2019-05-21 |
| 10283470 | Semiconductor package and manufacturing method thereof | Chih-Wei Lin, Shing-Chao Chen, Chen-Hua Yu, Chung-Shi Liu, Meng-Tse Chen +2 more | 2019-05-07 |
| 10283377 | Integrated fan-out package and manufacturing method thereof | Meng-Tse Chen, Chung-Shi Liu, Chih-Wei Lin, Sheng-Hsiang Chiu, Yao-Tong Lai | 2019-05-07 |
| 10276536 | Structure and formation method of chip package with fan-out structure | Hao-Jan Pei, Chih-Chiang Tsao, Wei-Yu Chen, Hsiu-Jen Lin, Ming-Da Cheng +1 more | 2019-04-30 |
| 10276537 | Integrated fan-out package and manufacturing method thereof | Ai-Tee Ang, Shing-Chao Chen, Chih-Wei Lin, Ching-Yao Lin | 2019-04-30 |