Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10325883 | Package-on-package structure and method | Meng-Tse Chen, Ching-Hua Hsieh, Chung-Shi Liu, Sheng-Feng Weng, Ming-Da Cheng | 2019-06-18 |
| 10283377 | Integrated fan-out package and manufacturing method thereof | Meng-Tse Chen, Ching-Hua Hsieh, Chung-Shi Liu, Chih-Wei Lin, Yao-Tong Lai | 2019-05-07 |
| 10283470 | Semiconductor package and manufacturing method thereof | Chih-Wei Lin, Shing-Chao Chen, Ching-Hua Hsieh, Chen-Hua Yu, Chung-Shi Liu +2 more | 2019-05-07 |