Issued Patents 2019
Showing 1–25 of 34 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522480 | Packaging devices and methods of manufacture thereof | Hsien-Wei Chen, Tsung-Yuan Yu, Wen-Hsiung Lu | 2019-12-31 |
| 10522452 | Packaging methods for semiconductor devices including forming trenches in workpiece to separate adjacent packaging substrates | Kuei-Wei Huang, Wei-Hung Lin, Chih-Wei Lin, Chun-Cheng Lin, Meng-Tse Chen +1 more | 2019-12-31 |
| 10515915 | Methods of forming connector pad structures, interconnect structures, and structures thereof | Chia-Lun Chang, Chung-Shi Liu, Hsiu-Jen Lin, Hsien-Wei Chen, Wei-Yu Chen | 2019-12-24 |
| 10515900 | Chip package with fan-out structure | Shing-Chao Chen, Chih-Wei Lin, Tsung-Hsien Chiang, Ching-Hua Hsieh | 2019-12-24 |
| 10513070 | Wafer level transfer molding and apparatus for performing the same | Bor-Ping Jang, Yeong-Jyh Lin, Chien Ling Hwang, Chung-Shi Liu, Meng-Tse Chen +1 more | 2019-12-24 |
| 10510716 | Packaged semiconductor devices and methods of packaging semiconductor devices | Chen-Hua Yu, Chung-Shi Liu, Chih-Fan Huang, Hui-Min Huang, Wei-Hung Lin | 2019-12-17 |
| 10510697 | Semiconductor package system and method | Hui-Min Huang, Chih-Wei Lin, Tsai-Tsung Tsai, Chung-Shi Liu, Chen-Hua Yu | 2019-12-17 |
| 10510644 | Package structures and methods for forming the same | Ching-Wen Hsiao, Chih-Wei Lin, Chen-Shien Chen, Chih-Hua Chen, Chen-Cheng Kuo | 2019-12-17 |
| 10510630 | Molding structure for wafer level package | Chen-Hua Yu, Chung-Shi Liu, Chih-Fan Huang, Chih-Wei Lin, Wei-Hung Lin | 2019-12-17 |
| 10512124 | Warpage control in the packaging of integrated circuits | Hsiu-Jen Lin, Cheng-Ting Chen, Wei-Yu Chen, Chien-Wei Lee, Chung-Shi Liu | 2019-12-17 |
| 10510734 | Semiconductor packages having dummy connectors and methods of forming same | Chen-Shien Chen, Hsiu-Jen Lin, Ming-Chih Yew, Yi-Jen Lai, Yu-Tse Su +2 more | 2019-12-17 |
| 10510731 | Package-on-package (PoP) structure including stud bulbs | Chen-Hua Yu, Mirng-Ji Lii, Chung-Shi Liu | 2019-12-17 |
| 10510719 | Methods of packaging semiconductor devices and packaged semiconductor devices | Chen-Hua Yu, Chung-Shi Liu, Meng-Tse Chen, Hui-Min Huang, Chih-Fan Huang | 2019-12-17 |
| 10490539 | Package on-package structure including a thermal isolation material and method of forming the same | Meng-Tse Chen, Kuei-Wei Huang, Tsai-Tsung Tsai, Ai-Tee Ang, Chung-Shi Liu | 2019-11-26 |
| 10475764 | Die bonder and methods of using the same | Chen-Hua Yu, Shing-Chao Chen, Chung-Shi Liu | 2019-11-12 |
| 10475679 | Semiconductor processing boat design with pressure sensor | Ai-Tee Ang, Hsiu-Jen Lin, Wei-Hung Lin, Chung-Shi Liu | 2019-11-12 |
| 10468377 | Device package including molding compound having non-planar top surface around a die | Chen-Hua Yu, Meng-Tse Chen, Chung-Shi Liu | 2019-11-05 |
| 10373941 | Package-on-package structures and methods for forming the same | Kuei-Wei Huang, Chih-Wei Lin, Hsiu-Jen Lin, Wei-Hung Lin, Chung-Shi Liu | 2019-08-06 |
| 10373931 | Semiconductor package structure and method of manufacturing the same | Jeng-Nan Hung, Chun-Hui Yu, Kuo-Chung Yee, Yi-Da Tsai, Wei-Hung Lin +1 more | 2019-08-06 |
| 10325883 | Package-on-package structure and method | Sheng-Hsiang Chiu, Meng-Tse Chen, Ching-Hua Hsieh, Chung-Shi Liu, Sheng-Feng Weng | 2019-06-18 |
| 10325853 | Method of forming semiconductor packages having through package vias | Chen-Hua Yu, Chung-Shi Liu, Chih-Wei Lin | 2019-06-18 |
| 10297579 | Package on-package structure with epoxy flux residue | Chen-Hua Yu, Wei-Yu Chen, Kuei-Wei Huang, Hsiu-Jen Lin, Ching-Hua Hsieh +2 more | 2019-05-21 |
| 10283427 | Molding structure for wafer level package | Chen-Hua Yu, Chung-Shi Liu, Chih-Fan Huang, Chih-Wei Lin, Wei-Hung Lin | 2019-05-07 |
| 10276541 | 3D package structure and methods of forming same | Meng-Tse Chen, Chung-Shi Liu, Chih-Wei Lin, Hui-Min Huang, Hsuan-Ting Kuo | 2019-04-30 |
| 10276548 | Semiconductor packages having dummy connectors and methods of forming same | Chen-Shien Chen, Hsiu-Jen Lin, Ming-Chih Yew, Yi-Jen Lai, Yu-Tse Su +2 more | 2019-04-30 |