Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10373931 | Semiconductor package structure and method of manufacturing the same | Chun-Hui Yu, Kuo-Chung Yee, Yi-Da Tsai, Wei-Hung Lin, Ming-Da Cheng +1 more | 2019-08-06 |
JH
Jeng-Nan Hung
Overall (2019): #421,996 of 560,194Top 80%
1
Patents 2019