Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10373931 | Semiconductor package structure and method of manufacturing the same | Jeng-Nan Hung, Chun-Hui Yu, Kuo-Chung Yee, Wei-Hung Lin, Ming-Da Cheng +1 more | 2019-08-06 |
YT
Yi-Da Tsai
Overall (2019): #213,048 of 560,194Top 40%
1
Patents 2019